According to foreign media reports, for more than 50 years, scientists have been looking for ways to make silicon materials that emit light. It has become the "holy grail" of microelectronics. The primary selection of light-emitting silicon will mean faster on-chip communication, lower heat production and higher power efficiency. Now, researchers from Eindhoven University of Technology (TU / e) have solved this decades-old problem by making a new hexagonal silicon alloy that emits light.
The shape of the hexagon is the key to creating direct bandgap emission photons.
"The key lies in the nature of the so-called semiconductor band gap," pointed out Erik Bakkers, TU / e project leader. "If an electron 'drops' from the conduction band to the valence band, the semiconductor will emit photons: light.
In traditional cubic silicon, because the conduction band and valence band are replaced to form an indirect band gap, they cannot emit photons. However, the theory 50 years ago believed that the hexagonal alloy silicon and germanium would have a direct band gap. The trick is to make such an alloy.
This goal was not achieved until people discovered the tubes and wires. In 2015, the team made hexagonal silicon from another material, and they also used it as a template to develop hexagonal silicon with a germanium shell.
"We can do this by allowing silicon atoms to build on the hexagonal template, which forces silicon atoms to grow in the hexagonal structure," said Elham Fadaly, co-author of the team's paper.
Related research reports have been published in "Nature".
Now, researchers need to develop a silicon-compatible laser. According to Bakkers, they may be able to build such a device before the end of the year. "If all goes well, we can manufacture a silicon-based laser in 2020. This will allow optical functions to be tightly integrated on mainstream electronic platforms, which will break the prospects of on-chip optical communications and inexpensive chemical sensors based on spectroscopy."
Since photons are not affected by resistance and have less scattering in the conductive medium, no heat is generated during this process, so power consumption can be greatly reduced. In addition, in the future photonic silicon, the communication speed between the chip and the chip can be increased by 1000 times. The technology has many application scenarios, such as lidar in autonomous vehicles, chemical sensors in the medical and food industries, and so on.
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